smt packaging 2017 Nuremberg
smt packaging 2017 – Nuremberg
As usual, the company Schnaidt is represented as an exhibitor at the SMT Hybrid Packaging Fair in Nuremberg with new interesting and innovative products for the production of assembled modules. This year the focus is on the support of assemblies during paste printing.
Experience of our customers shows that far more than half of the problems occurring in the SMD process are caused by a non-uniform application of the solder paste during stencil printing.
Above all, assemblies with large outer dimensions can deviate during the stencil printing process and thus produce a pressure offset.
Often the process parameters, which can be effectively counter-controlled, are limited and the smaller and smaller components as well as the smaller pitch distances increase the error rate.
Contrary to the frequently used method of “testing quality in the product” after the pressure already exerted over ever more elaborate optical measuring systems, our stencil printing support starts directly at the process. Let our specialists advise you about the possibilities to optimize your printing process and visit us at our booth Hall 4 Booth 459.
- 16 to 18 April 2017
- Hall 4 / booth 459