We can look back at an eventful SMT 2017 trade fair
SMT 2017 has ended
Technical discussions of both a personal and constructive nature which we conducted at this event represented considerable added value for our company.
Our latest product, the stencil printing support, attracted visitors like a magnet. This innovation is a successful addition to our portfolio in the process engineering area. The experience of our customers indicates that more than half the problems encountered in the SMD process occur as a result of uneven application of solder paste during stencil printing. In particular, assemblies with large outer dimensions can shift during the stencil printing process, resulting in misalignment during printing. In many cases, the process parameters which can effectively counter this are limited, and increasingly smaller components and pitch distances add to the rejection rate.
In contrast to frequently employed methods involving the checking of product quality on completion of printing using increasingly sophisticated measurement systems, our stencil printing support intervenes directly in the process.
Following a long and exhausting day at the trade fair, our customers also had the chance to refresh themselves again with a cold drink and snack in our very own beer garden.
Your visit to our stand contributed decisively to our success, and we are looking forward to working closely with you on new exciting projects.